LED high power chip heat dissipation double-sided polishing molybdenum substrate molybdenum wafer

Product category: Polished Molybdenum Substrate

Shop sign: Mo

Molydbenum content: ≥99.96%

Application field: LED chip heat dissipation substrate

Product customization: it can be produced and processed according to drawings or samples, and the production cycle is about 30 days

Description

Product advantages: the company’s double-sided polishing molybdenum substrate,moly wafer, molybdenum Moly substrate, molybdenum wafer polishing to mirror (Ra < 0.03um). Molybdenum Moly base plate and molybdenum copper base plate have good conductivity, are not easy to crack, and have excellent heat dissipation effect. It can be used as the heat dissipation substrate of LED high current chip or the best choice of reflector substrate.

Common problems

 

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