Melting point of molybdenum(2625°C), boiling point (4600°C), hardness (5.5), and density (10.2 g/cm3), making it a good conductor of electricity and heat.
Molybdenum offers the following performance advantages:
- The thermal expansion coefficient of molybdenum is very low and similar to that of silicon single crystal; 100°C is 4.53×10-6/°C; 400°C is 5.34×10-6/°C; 700°C is 5.72×10-6/°C,
- Molybdenum has a high density of 10.2 g/cm3 and high thermal conductivity;
- Molybdenum has a lower resistivity: 5.17×10-10Ω·cm when 0℃; 24.6×10-10Ω·cm when 800℃; 72×10-10Ω·cm when 2400℃.
- Molybdenum is a paramagnet and the specific heat of molybdenum is 242 at 25°C. 8J/(kg·K)。
- The hardness of molybdenum is relatively large, the Mohs hardness is 5~5.5; the Vickers hardness of molybdenum square sheet (HV250-300)
Applications of molybdenum
Molybdenum metal has a wide range of applications in electronic devices such as tubes, transistors and rectifiers
- Used as grid and anode support material in electron tubes.
- Molybdenum is used as a metal oxide semiconductor gate in very large integrated circuits, and the “bimetal effect” can be eliminated by mounting the integrated circuit on the molybdenum.
- Molybdenum discs can also be used as substrates and heat sinks for power transistor heat shields and silicon rectifiers.
- Molybdenum square is used as power semiconductor thermal compensation sheet and substrate.
Double-sided polished molybdenum substrate (mirror and surface roughness≤0.03μm), applied toLEDlight-emitting chip, replace sapphire as substrate, with better heat dissipation。